Method for the plasma-activated reactive deposition of electrically conductive multicomponent material from a gas phase

US4965090A · kind A · utility

Assignee

• U.S. Philips Corporation · US

Inventors

• Georg Gartner · Aachen, DE
• Peter A. Janiel · Würselen, DE
• Hans Lydtin · Stolberg, DE

Key dates

• Filing date: Jan 4, 1989
• Grant date: Oct 23, 1990
• Expiry date: Jan 4, 2009

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/5093
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Electrically conductive multicomponent material is deposited on a tubular substrate (3) by means of a PCVD method. A plasma (9) is produced between an inner electrode (13) and an outer electrode, one of which is tubular and serves as a substrate. In order to obtain multicomponent material of the desired composition, the composition of the gas phase is changed as a function of time and/or place. In particular when metalorganic starting compounds are used, PCVD of many single layers together with an intermittent, for example, Ar/O.sub.2 plasma intermediate treatment yields an efficient removal of undesired carbon or fluorine from the deposited multicomponent material already during its manufacture.