Semiconductor device and method of mounting the semiconductor device
US4965653A · kind A · utility
12Cited by
7References
21Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 28, 1990 |
| Grant date | Oct 23, 1990 |
| Priority date | — |
| Expiry date | Feb 28, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a suitable mounting of a wafer scale LSI (wafer scale integration) (WSI) in which a slit formed in a wafer is fit to a connector, a U-shaped reinforcing rubber member is disposed at the circumferential edge of the wafer, or a flexible adhesive is used for bonding a substrate formed with through-holes and a wafer, to provide a WSI mounting structure of high integration degree and high reliability. Furthermore, a method of efficient mounting by conducting the wiring of the wafer and the connection with the external terminal of the chip in one identical production step is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.