Process for making insert molded circuit
US4965933A · kind A · utility
41Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 1989 |
| Grant date | Oct 30, 1990 |
| Priority date | — |
| Expiry date | May 22, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49986
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for forming insert molded circuits. The process includes inserting a circuit network comprised of a lace curtain with a plurality of individual circuits which are connected by interconnect members into a mold and then separating the individual circuits in the mold by cutting the interconnect members while the lace curtain is in the mold. After the interconnect members have been severed, plastic is injected into the mold thereby surrounding the individual traces. A mold for performing the process is disclosed which includes a retractable punch arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.