Electronic circuit and method of production thereof
US4967313A · kind A · utility
22Cited by
2References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 7, 1989 |
| Grant date | Oct 30, 1990 |
| Priority date | — |
| Expiry date | Jul 7, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic circuit with flip-chip mounting of a semiconductor chip (5) on a substrate (1), wherein there is provided between the semiconductor chip (5) and the conductor tracks (2) of the substrate (1) a metallic solder stop layer (3) which is insulated from its environment by an oxide layer (4). With this type of solder stop layer, it is possible to obtain layer thickness which can be exactly reproduced, as a result of which a reliable flip-chip soldering is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.