Circuit board construction
US4967314A · kind A · utility
70Cited by
10References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 1, 1989 |
| Grant date | Oct 30, 1990 |
| Priority date | — |
| Expiry date | Nov 1, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1453
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high density multi-level printed wiring board having inter-level electrical connections made by via interconnect holes which are drilled or punched through only those layers of the wiring board that separate the two layers containing the conductors which are to be connected and said holes being filled with a low-resistance silver-filled conductive epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.