Polishing method and apparatus
US4967517A · kind A · utility
Inventor
Key dates
| Filing date | Sep 11, 1989 |
| Grant date | Nov 6, 1990 |
| Priority date | — |
| Expiry date | Sep 11, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D15/023
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method and apparatus is set forth utilizing an elongate stepped base assembly comprising a planar lower surface spaced below a a parallel upper surface. The upper surface includes a FIG. 8 recess therein defined by two overlapping cylindrical recesses. Each of the cylindrical recesses are of a predetermined diameter to receive a polishing rod defined by a diameter less than that of said predetermined diameter to be slidably received within each of said recesses. The polishing rod has secured thereto a first adhesive band adherably mounting a second adhesive strap onto a lowermost end surface of the polishing rod. A workpiece is adherably mounted to the second adhesive strap and directed interiorly of one of said cylindrical recesses subsequent to positioning a fabric polishing sheet containing polishing compound within the one cylindrical recess. Subsequently the polishing rod and workpiece are removed from the first of the set of cylindrical recesses and directed interiorly of a second of the interior cylindrical recesses to finish a buffing procedure of the workpiece. The first lower planar surface is oriented for reception of an enlarged polishing sheet thereon for b…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.