Etching apparatus
US4968375A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1989 |
| Grant date | Nov 6, 1990 |
| Priority date | — |
| Expiry date | Nov 8, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor substrate etching apparatus is disclosed. In this apparatus, a semiconductor substrate is mounted on the upper surface of a first vacuum chuck, an etching solution is supplied to a groove of a roller of a semiconductor substrate end surface etching mechanism, which covers the end surface of the semiconductor substrate, and the first vacuum chuck and the roller are rotated in the opposite directions. The end surface of the semiconductor substrate is brought into contact with the etching solution. The etching solution is then transferred onto the end surface of the substrate, thus performing etching of the end surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.