Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene
US4968780A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1990 |
| Grant date | Nov 6, 1990 |
| Priority date | — |
| Expiry date | Apr 25, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0017
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzens are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.