Patent · US Expired

Electronic module

US4969066A · kind A · utility

13Cited by

7References

9Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Erwin Eibl · Amberg, DE
Heinz Schmidt · Steinfeld (Oldenburg), DE
Heribert Rester · Fulda, DE

Key dates

Filing date	Jun 30, 1989
Grant date	Nov 6, 1990
Priority date	—
Expiry date	Jun 30, 2009

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/142
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An electronic module includes two printed-circuit boards which are equipped with hybrid assemblies. The electronic module takes up only a small amount of space and, at the same time, efficiently dissipates the heat loss caused by the hybrid assemblies. The hybrid assemblies are arranged in such a manner that they can be interspersed with one another, similar to a sandwich-type construction. The interspersing provides duct-type, perpendicularly aligned interspaces between the hybrid assemblies, allowing the heat loss to be dissipated in a chimney-like fashion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.