Method of forming a conductor connection structure of crimp contact
US4969260A · kind A · utility
13Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 1989 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | May 30, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4921
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A crimp contact for providing a secure mechanical and electrical contact between wire conductors and a contact portion, includes a moisture-impermeable cross-linking adhesive filling the gaps between the crimp portion of the crimp contact and the wire conductors, and between adjacent wire conductors. The adhesive is cross-linked subsequent to filling the gaps, thereby hardening the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.