Patent · US Expired

Method for uniting workpieces of silicon-infiltrated silicon carbide with large dimensions in a materially bonded manner and apparatus for performing the method

US4969592A · kind A · utility

3Cited by

6References

15Claims

0Family size

Assignees

Interatom GMBH · DE
Didier-Werke AG · DE

Inventors

Mohamed Yarahmadi · Fulda, DE
Hartmut Kainer · Wiesbaden, DE
Juergen Sommerer · Rauenthal, DE

Key dates

Filing date	Jun 21, 1989
Grant date	Nov 13, 1990
Priority date	—
Expiry date	Jun 21, 2009

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2237/765
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A method and apparatus for uniting workpieces of silicon-infiltrated silicon carbide with large dimensions includes surrounding each of two silicon-infiltrated silicon carbide workpieces with at least one tightly closing shell in the vicinity of a junction between the workpieces, defining at least one intermediate space between the shell and the workpieces. A vacuum or an inert gas atmosphere is maintained in the intermediate space or spaces. Solder is placed at the junction and the junction is locally heated to soldering temperature for materially bonding the workpieces by soldering at the junction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.