Directly thermally coupled adhesive dispenser
US4969601A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 1, 1989 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | May 1, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C5/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hot-melt adhesive dispenser having a multi-orifice nozzle manifold in surface-to-surface heat transfer engagement with a heated member. A first sealing element cooperates with a second sealing element to provide a heated member-to-nozzle manifold engagement which is sufficiently inelastic to inhibit adhesive drool between applications, is leak-resistant, and is unlikely to produce air pockets. The first sealing element is a hollow tapered stem having a base which receives adhesive going from within said heated member. The dimensionally reduced tip of the tapered stem is press fit into an inlet bore of the nozzle manifold for fluid communication with a plurality of nozzles. The second sealing element is a high temperature O-ring seated on that portion of the tapered stem not received within the inlet bore. The tapered stem forms a relatively inelastic fit, while the O-ring provides a relatively elastic fit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.