Method for etching an electrically conductive layer applied to a substrate
US4969973A · kind A · utility
11Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1989 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | Sep 26, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/068
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In the etching by means of an etching solution of an electrically conductive layer applied to a substrate the time profile or variation of the diffusion current flowing between the layer to be etched away and the etching solution is measured. The substrate is removed from the etching solution as soon as the diffusion current passes through a steep drop for the second time and assumes a constant value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.