Patent · US Expired

Method for etching an electrically conductive layer applied to a substrate

US4969973A · kind A · utility

11Cited by
2References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 26, 1989
Grant dateNov 13, 1990
Priority date
Expiry dateSep 26, 2009

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/068
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

In the etching by means of an etching solution of an electrically conductive layer applied to a substrate the time profile or variation of the diffusion current flowing between the layer to be etched away and the etching solution is measured. The substrate is removed from the etching solution as soon as the diffusion current passes through a steep drop for the second time and assumes a constant value.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.