Chemical deposition methods using supercritical fluid solutions
US4970093A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1990 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | Apr 12, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2401/90
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for depositing a film of a desired material on a substrate comprises dissolving at least one reagent in a supercritical fluid comprising at least one solvent. Either the reagent is capable of reacting with or is a precursor of a compound capable of reacting with the solvent to form the desired product, or at least one additional reagent is included in the supercritical solution and is capable of reacting with or is a precursor of a compound capable of reacting with the first reagent or with a compound derived from the first reagent to form the desired material. The supercritical solution is expanded to produce a vapor or aerosol and a chemical reaction is induced in the vapor or aerosol so that a film of the desired material resulting from the chemical reaction is deposited on the substrate surface. In an alternate embodiment, the supercritical solution containing at least one reagent is expanded to produce a vapor or aerosol which is then mixed with a gas containing at least one additional reagent. A chemical reaction is induced in the resulting mixture so that a film of the desired material is deposited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.