Thin film multilayer laminate interconnection board
US4970106A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1990 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | Mar 28, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of assembling a multilayer laminate interconnection board, particularly boards in which each layer preferably includes copper conductors on polyimide film layers, involves adhesively joining individual layers of wired film initially onto an auxiliary pin carrier substrate and then onto a previously laminated layer. After each layer is aligned and adhesively joined to the immediately preceeding layer, holes are formed through the layer. Metal is deposited into the holes for electrically connecting conductors on the top surface of the last layer to a via located on the immediately preceeding layer. The process is repeated for each layer of the multilayer laminate interconnection board until the entire board is completely assembled. Alternatively, layers containing preformed and metalized holes at the location of a respective via in a particular layer are aligned and adhesively laminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.