Method and apparatus for the thin film deposition of materials with a high power pulsed laser
US4970196A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1988 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | Aug 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/732
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides an apparatus and method for laser direct writing of materials onto a receiving substrate using a high power pulsed laser. The invention includes a pulsed laser light source, a receiving substrate, disposed opposite the pulsed laser light source, and an optically transparent source support substrate positioned between the receiving substrate and the pulsed laser light source, wherein a surface of the optically transparent source support substrate facing the receiving substrate has coated thereon a thin film of material to be deposited on the receiving substrate. Laser direct writing using the invention is accomplished by impinging the thin film of material with a pulsed laser light from the pulsed laser light source causing material to be selectively "blown off" the optically transparent source support substrate and deposited onto the surface of the receiving substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.