Flameproof thermoplastic molding materials based on partly aromatic amide copolymers
US4970255A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1989 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | Jul 10, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0373
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Flameproofed thermoplastic molding materials contain (A) 40-99% by weight of a partly aromatic amide copolymer consisting essentially of PA1 (a.sub.1) 40-50% by weight of units derived from terephthalic acid and hexamethylenediamine, PA1 (a.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam and PA1 (a.sub.3) 0-60% by weight of units derived from adipic acid and hexamethylenediamine, components (a.sub.2) and/or (a.sub.3) accounting altogether for not less than 10% by weight of the total number of units, (B) 1-30% by weight of a flameproofing combination of PA1 (b.sub.1) 40-97% by weight of red phosphorus, PA1 (b.sub.2) 1-50% by weight of an inorganic compound of a divalent or tetravalent metal, PA1 (b.sub.3) 1-40% by weight of an organic mono- or dicarboxylic acid and PA1 (b.sub.4) 1-40% by weight of an ester of an organic carboxylic acid of 6 to 24 carbon atoms with an alcohol of 2 to 24 carbon atoms or of a metal salt of such an acid, or a mixture of these, (C) 0-60% by weight of fibrous or particulate fillers or a mixture of these, and (D) 0-40% by weight of a polymeric impact modifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.