Power semiconductor module and method for producing the module

US4970576A · kind A · utility

Assignee

• Asea Brown Boveri, S.A. · CH

Inventors

• Arno Neidig · Plankstadt, DE
• Hubert Hettmann · Hockenheim, DE

Key dates

• Filing date: May 19, 1988
• Grant date: Nov 13, 1990
• Expiry date: May 19, 2008

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/351
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module and method for producing the module includes a plastic housing having a lower surface. An electrically insulating substrate having an upper surface is inserted in the lower surface of the plastic housing for supporting electrical components. A metallization is disposed at least on the upper surface of the substrate. The metallization on the upper surface of the substrate is patterned to form conductor tracks. Components are soldered onto the patterned metallization. Locating compartments disposed in the plastic housing form a soldering jig for the components during production of the module.