Process plate for plastic pin grid array manufacturing
US4970781A · kind A · utility
12Cited by
5References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1989 |
| Grant date | Nov 20, 1990 |
| Priority date | — |
| Expiry date | Aug 10, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process plate for the manufacture of molded electronic packages such as plastic pin grid array packages is provided. The process plate is a single fixture which is used to position terminal pins, align the pins for electrical interconnection and form the base of the mold during encapsulation. In one embodiment, the process plate comprises a support plate which is used for all standard terminal pin configurations and a thin cover plate which is specific for each terminal pin configuration. The process plate reduces the number of fixtures required to mold an electronic package reducing both cost and assembly error.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.