Apparatus for cutting semiconductor crystal
US4971021A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1988 |
| Grant date | Nov 20, 1990 |
| Priority date | — |
| Expiry date | Jul 25, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/855
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for cutting a semiconductor crystal ingot into wafers includes a rotary blade, a first sensor, a second sensor and a computing unit. The blade is of a generally disk shape having a mark put thereon. The first sensor is stationarily located in opposed relation to the blade for sensing a distance between the blade and the first sensor to produce a first signal representative of the distance. The second sensor is stationarily disposed in opposed relation to the blade for detecting the mark of the blade to produce a second signal representative of a position of the mark. The computing unit is connected to the first and second sensors for receiving the first signal from the first sensor in synchronization with the second signal from the second sensor, and computing an amount of warp of the blade as to a fixed position thereof by using the received first signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.