Multilayer glass passivation structure and method for forming the same
US4972251A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 14, 1985 |
| Grant date | Nov 20, 1990 |
| Priority date | — |
| Expiry date | Aug 14, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thick glass passivation layer comprises an alternating sequence of structurally dissimilar but chemically compatible layers of material over the surface of a substrate, so as to provide sufficient elasticity to compensate for thermal expansion differences that would otherwise crack causing in thick monolithic films. A first layer comprises glass that has been deposited over the surface of the structure using chemical vapor deposition. A second layer of the passivating glass material is then provided on the substrate using a spinning technique. The chemical vapor deposition and spun layers continue to be applied in an alternating fashion until a film having the desired thickness is formed. Each chemical vapor deposition layer provides an elastic cushion for the subsequently spun layers. The spun layers allows a planar topography to be maintained without the need for high temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.