Apparatus for removal and installing electronic components with respect to a substrate
US4972990A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1988 |
| Grant date | Nov 27, 1990 |
| Priority date | — |
| Expiry date | Feb 22, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0486
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and .theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.