Polyamide from diamino-t-butylbenzene
US4973659A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1988 |
| Grant date | Nov 27, 1990 |
| Priority date | — |
| Expiry date | Nov 30, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0017
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamono-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.