Printed circuit board for use with an image forming apparatus
US4973799A · kind A · utility
17Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1989 |
| Grant date | Nov 27, 1990 |
| Priority date | — |
| Expiry date | Aug 21, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board for mounting a CPU for controlling an image processing apparatus, comprising a multilayered circuit board for mounting the CPU, and a shield layer for shielding the multilayered circuit board without connecting the shield layer to the circuits of the board. The circuits of the multilayered circuit board are produced by a printing or an electrolytic plating method or an electroless plating method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.