Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether
US4975319A · kind A · utility
22Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1989 |
| Grant date | Dec 4, 1990 |
| Priority date | — |
| Expiry date | Apr 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2713
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.