Process enhancement using molybdenum plugs in fabricating integrated circuits
US4975386A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1989 |
| Grant date | Dec 4, 1990 |
| Priority date | — |
| Expiry date | Dec 22, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of interconnecting circuit components in a semiconductor integrated circuit including component elements formed in the substrate and thin-film resistors and capacitors formed on a surface of the substrate, a molybdenum plug is utilized to facilitate stable, uniform low resistance contacts to circuit elements, molybdenum (moly) plugs are utilized as a barrier between interconnect metallization and the circuit components. A CLAD moly/aluminum metallization interconnect can be fabricated in a standard process in which the moly plugs are formed. The accuracy and stability of thin-film resistors is facilitated during wafer processing, laser trimming, temperature cycling, and assembly processing thereby providing repeatable matching by eliminating contact resistance as a process variable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.