Photo-curable epoxy resin type composition
US4975471A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1988 |
| Grant date | Dec 4, 1990 |
| Priority date | — |
| Expiry date | Aug 29, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0385
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photo-curable epoxy resin type composition which comprises (a) an epoxy resin, (b) at least one compound selected from the group consisting of (i) a compound having a group, other than an imido group, which is represented by the formula --CONH and (ii) an aromatic amine, (c) an organic metal compound, where said metal is selected from the group consisting of titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, aluminum and zirconium; and (d) an organic silicon compound having at least one group selected from the group consisting of a peroxysilyl group and an o-nitrobenzyloxy group capable of forming a silanol group by irradiation with light. The photo-curable epoxy resin type composition according to this invention is capable of readily curing by light (ultraviolet ray in particular) and also capable of heat curing at a temperature of 150.degree. C. or more, and yet provides a cured product that is free of ionic impurities, does not corrode metallic materials which may be in contact with the composition, and displays excellent electrical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.