Highly integrated circuit and method for the production thereof
US4975765A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1989 |
| Grant date | Dec 4, 1990 |
| Priority date | — |
| Expiry date | Jul 7, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a highly integrated circuit the semiconductor chip (8) is fastened on a substrate (17) which projects on all sides only a few millimeters beyond the semiconductor chip (8). For Full dynamic testing of the circuit before insertion, connections are provided which are arranged outside the projecting substrate edge (23) with a sufficiently large grid spacing. In a first embodiment (FIG. 2D) "lost" test connections (5) are used which are separated after testing. In a second embodiment (FIG. 3E), contact areas in the form of bumps (21) are used for testing which are arranged on the underside of the through-holes (18) lying in the chip mounting area. In this manner it is possible to realize a circuit with greatly reduced space requirement, which at the same time can be fully tested dynamically before insertion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.