Electroplating apparatus for plate-shaped workpieces
US4976840A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 16, 1989 |
| Grant date | Dec 11, 1990 |
| Priority date | — |
| Expiry date | Aug 16, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/28
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards which are guided through an electrolytic solution in a horizontal path for the application of metal has a conveying arrangement comprising laterally arranged upper band drives and laterally arranged lower band drives whereby the workpieces are entrained in a friction-actuated fashion between a lower run of the upper band drive and an upper run of the lower band drive. In addition, a sealing wall is arranged between the upper and lower runs of each of the band drives to produce a sealing arrangement for a laterally exposed edge of the workpiece, which is engaged by a contacting mechanism for the cathodic contacting of the workpiece projecting through the band drives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.