Composite polymer/desiccant coatings for IC encapsulation
US4977009A · kind A · utility
64Cited by
20References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1990 |
| Grant date | Dec 11, 1990 |
| Priority date | — |
| Expiry date | Mar 6, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention is directed to composite coating for maintaining low moisture levels at the surface of solid substrates. One embodiment of the invention comprises a coating having a desiccant layer between layers of the same or different elastomeric polymers. Another embodiment comprises a layer of elastomeric polymer covered with a layer of an elastomeric polymer/desiccant mixture. The composite coating may be applied to integrated circuits to prevent corrosion thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.