Moulding compositions comprised of semirigid, fatty acid copolyamides, elastomers and optionally conventional polyamides
US4977213A · kind A · utility
57Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1987 |
| Grant date | Dec 11, 1990 |
| Priority date | — |
| Expiry date | Jun 8, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyamide-based molding compositions having enhanced flexibility and resilience, especially at low temperatures, are prepared from (1) semirigid copolyamides prepared from fatty acid dimers, (2) elastomers containing moieties compatible or reactive with such copolyamides (1) and comprising olefinic copolymers bearing carboxyl and/or carboxylate groups, copolyester-amides, polyurethanes, organopolysiloxane and polyurethane block copolymers, and copolymers produced from a latex which comprises suitable functional groups, and, optionally, (3) conventional polyamides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.