Semiconductor module and an electronic computer using the semiconductor module
US4977443A · kind A · utility
5Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1989 |
| Grant date | Dec 11, 1990 |
| Priority date | — |
| Expiry date | Sep 19, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module comprises semiconductor elements, cooling structures for cooling the semiconductor elements by liquid refrigerant, and a housing for accommodating the semiconductor elements and the cooling structures, wherein within the housing, there is supplied or enclosed sealingly a reactive gas which reacts with ions of a metal constituting the cooling structures to form a chemical compound hard to dissolve to the refrigerant but does not react with the metal itself constituting the cooling structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.