Laser trimming system for semiconductor integrated circuit chip packages
US4978830A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1989 |
| Grant date | Dec 18, 1990 |
| Priority date | — |
| Expiry date | Feb 27, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An automatic laser trimming apparatus (30) for semiconductor integrated chip packages removes dambars (16) and performs deflashing and degating operations. The apparatus combines a laser machining subsystem (32, 36) with a machine vision subsystem (38, 40) to accurately locate the treat and dambars on an integrated circuit package. A defocusing lens (54) is used to attenuate the intensity of the laser beam (34) to permit a single laser to perform both the dambar removal and deflashing operations. In addition, an improved fixture (46) is provided to enhance the removal of smoke and debris from the processing station and to provide improved backlighting thereby enhancing resolution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.