Printed circuit board heat sink
US4979074A · kind A · utility
106Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1989 |
| Grant date | Dec 18, 1990 |
| Priority date | — |
| Expiry date | Jun 12, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10598
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink for a printed circuit board in comprised of a thermally-conductive plate having on one surface a thermally-conductive, electrically-insulative elastomer layer which conformally engages at leasts a portion of the back surface of the printed circuit board. The ends of pins of electronic components mounted on the board and desired to be cooled embed into the elastomer layer to provide a conductive path for transfer of heat from the electronic components to the elastomer layer and then to the thermally-conductive plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.