Apparatus for treating wafers in the manufacture of semiconductor elements
US4979464A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1988 |
| Grant date | Dec 25, 1990 |
| Priority date | — |
| Expiry date | Jun 13, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for the treatment of wafers in the manufacture of semiconductor elements in the form of a process buffer through which a plurality of wafers travel at the same time to various treatment stations and which cooperates with a transport apparatus for the wafers. The apparatus has a shaft magazine, in which the treatment stations, each for one wafer, are disposed spaced apart from and above one another. The shaft magazine is provided with a loading and unloading opening, and the treatment stations are movable individually into the vicinity of the loading and unloading opening. The apparatus occupies less surface area in the process line for the manufacture of semiconductor elements, enables treatment of the wafers independent of external factors, and can be used for various types of treatment of the wafers in the manufacture of semiconductor elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.