Direct bonding of ceramic parts by a silver alloy solder

US4980243A · kind A · utility

Assignee

• Degussa AG · DE

Inventors

• Willi Malikowski · Aschaffenburg, DE
• Wolfgang Weise · Frankfurt, DE

Key dates

• Filing date: Jul 7, 1989
• Grant date: Dec 25, 1990
• Expiry date: Jul 7, 2009

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31678
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Solders for directly soldering together ceramic parts consisting essentially of 70 to 99% silver, 0.5 to 15% by weight indium or 0.5 to 10% by weight tin and 0.5 to 15% by weight titanium or zirconium, or mixtures thereof. These solders are very ductile, are workable at comparatively low temperatures and provide very firm bonding.