Transition metal clad interconnect for integrated circuits
US4980752A · kind A · utility
22Cited by
2References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 29, 1986 |
| Grant date | Dec 25, 1990 |
| Priority date | — |
| Expiry date | Dec 29, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes a patterned aluminum based interconnect clad on the top and side portions with a layer of transition metal. The cladding of transition metal prevents the formation of both vertical hillocks and lateral protrusions. Preventing these formations increases the reliability of an interconnect by significantly reducing passivation cracking and electrical shorting between interconnects which result from vertical hillock and lateral protrusion formations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.