Copper etching bath and method of using
US4981553A · kind A · utility
7Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1988 |
| Grant date | Jan 1, 1991 |
| Priority date | — |
| Expiry date | Sep 16, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.