Process for the reproduction of a microstructured, plate-shaped body
US4981558A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 18, 1989 |
| Grant date | Jan 1, 1991 |
| Priority date | — |
| Expiry date | Dec 18, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for reproducing a structured, plate-shaped body, comprising the steps of: (a) providing a composite body containing an electrically insulating molding compound layer and an electrically conducting molding compound layer, (b) pressing a first microstructured body, having an outer face, into the electrically insulating molding compound layer while applying ultrasound so that the outer face of the first microstructured body projects into the electrically conducting layer, (c) removing the first microstructured body from the composite body while applying ultrasound to form an impression in the composite body, (d) electroplating a metal into the impression in the composite body to fill the impression with metal and form a second microstructured body, and (e) removing the composite body from the second microstructured body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.