Method of surface treatment of copper foil or a copper clad laminate for internal layer
US4981560A · kind A · utility
17Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1989 |
| Grant date | Jan 1, 1991 |
| Priority date | — |
| Expiry date | Mar 23, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The surface of copper foil or a copper clad laminate for an internal layer is subjected to electrolysis in an aqueous solution containing diethylenetriamine pentacetic acid and copper ion by using the copper foil or a copper clad laminate for the internal layer as the cathode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.