Heat-sensitive stencil sheet
US4981746A · kind A · utility
15Cited by
1References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1989 |
| Grant date | Jan 1, 1991 |
| Priority date | — |
| Expiry date | Apr 27, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The heat-sensitive stencil sheet of the present invention is a heat-sensitive stencil sheet including a thermoplastic film (3) laminated through an adhesive layer (2) on one surface of a porous base (1). The adhesive layer includes an ionizing-radiation-curable adhesive, and therefore the above porous support (1) and the thermoplastic film (3) can be rapidly and firmly adhered together, and yet printing resistance during printing can be improved simultaneously with the additional excellent effect of making the printed image sharper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.