Semiconductor integrated circuit device and method of manufacturing the same
US4982265A · kind A · utility
439Cited by
3References
4Claims
0Family size
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Key dates
| Filing date | Jun 22, 1988 |
| Grant date | Jan 1, 1991 |
| Priority date | — |
| Expiry date | Jun 22, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat packaging technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.