Capacitance guided assembly of parts
US4982333A · kind A · utility
9Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1988 |
| Grant date | Jan 1, 1991 |
| Priority date | — |
| Expiry date | Oct 13, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There are disclosed methods and apparatuses for the assembling of parts using capacitive sensing, both for controlling the closure or "homing" phase of the assembly process and for acquiring one or more of the parts prior to that phase. Assembling of semiconductor parts to essentially two-dimensional and three-dimensional packages, the insertion of a peg in a hole, and an application to tape-automated-bonding (TAB) technology are all described, as are various representations of the resulting capacitive data. Included are the uses of scheduling and optical sensing to supplement capacitive sensing in the methods and apparatuses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.