Resin encapsulating apparatus for semiconductor devices
US4983110A · kind A · utility
14Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1989 |
| Grant date | Jan 8, 1991 |
| Priority date | — |
| Expiry date | Mar 13, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.