Hot stamping decal resist
US4983246A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 3, 1989 |
| Grant date | Jan 8, 1991 |
| Priority date | — |
| Expiry date | Aug 3, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1394
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This present invention is directed to a new technique for supplying and applying resist to copper and other substrate material. In accordance with the present invention, a hot stamping resist decal comprises a release sheet bearing a pattern of the dried residue of a resist. The resist comprises an ester of a styrene/maleic anhydride copolymer, a particulate filler, and a solvent. Advantageously, a plasticizer is included in the resist formulation and the particulate filler preferably includes a clay. The method of manufacturing the inventive hot stamping resist decal and for hot stamping the decal on a circuit board form additional aspects of the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.