Process for producing printed circuit board
US4983252A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1989 |
| Grant date | Jan 8, 1991 |
| Priority date | — |
| Expiry date | Apr 10, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a process for fabricating a printed circuit board, a positive resist layer is electrodeposited on a copper clad laminate to ensure that the walls of through-holes in the substrate are completely coated with the resist, or alternatively, a film having a positive resist layer coated thereon is thermocompressed onto the copper clad laminate with the film being in contract with the latter, so as to cover both top and bottom of each through-hole. By subsequent treatments including resist exposure, development, copper foil etching and resist stripping, a high-density wiring pattern can be formed on the substrate in a uniform and consistent way even if through-holes exist in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.