Non plateout molding composition
US4983661A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1990 |
| Grant date | Jan 8, 1991 |
| Priority date | — |
| Expiry date | Feb 2, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L101/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A novel molding composition is described which prevents plateout of pigment on the surface of a mold or shaping apparatus during the molding or shaping operation. The composition has improved thermal and oxidation stability as well as increased compatibility of the components of the composition. The composition comprises a thermoplastic resin, a fluorescent pigment, a metal salt or complex, polymer or oligomer reagent containing a reactive functionality and other conventional additives. The composition is useful in preparing such molded articles as films, bottles, closures, furniture and toys.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.