Hot melt adhesive compositions
US4983674A · kind A · utility
4Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1988 |
| Grant date | Jan 8, 1991 |
| Priority date | — |
| Expiry date | Aug 10, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition which comprises: PA0 (a) a copolymer of vinyl aromatic compounds and conjugated dienic compounds, or a hydrogenated version thereof in amounts of about 20-70% by weight; PA0 (b) a tackifier comprising alicyclic hydrocarbon polymers in amounts of about 30-80% by weight; and PA0 (c) a 4-methylpentene-1 polymer in amounts of about 0.3-20% by weight, based on the composition, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.