Semiconductor device and a method for fabricating the same
US4984059A · kind A · utility
156Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1983 |
| Grant date | Jan 8, 1991 |
| Priority date | — |
| Expiry date | Oct 7, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/916
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.