Diamond compacts
US4985051A · kind A · utility
98Cited by
9References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 13, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Nov 13, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/96
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Diamond compact composed of 60-95 volume % diamond crystals plastically deformed into a closely packed, rigid structure with contacts between the diamond crystals over extended mating surfaces arising from the plastic deformation. The diamond crystals are bonded together by an interstitial bonding material composed of a refractory carbide, such as silicon carbide, or a bonding material composed of a metal such as rhenium and a refractory carbide formed by reaction of a metallic bonding agent, such as tungsten, with carbon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.